发明授权
- 专利标题： Integrated circuit package system with step mold recess
- 专利标题（中）： 集成电路封装系统，带步进模具凹槽
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申请号： US12053751申请日： 2008-03-24
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公开(公告)号： US08247894B2公开(公告)日： 2012-08-21
- 发明人: In Sang Yoon , HanGil Shin , Jae Han Chung , DeokKyung Yang
- 申请人： In Sang Yoon , HanGil Shin , Jae Han Chung , DeokKyung Yang
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley Chang
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
An integrated circuit package system includes: providing a stackable integrated circuit package system having a base encapsulation and a recess therein; stacking a top integrated circuit package system, having a top encapsulation with a protruding portion, with the stackable integrated circuit package system with the protruding portion aligned and matched within the recess; and connecting the top integrated circuit package system and the stackable integrated circuit package system.
公开/授权文献
- US20090236720A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STEP MOLD RECESS 公开/授权日：2009-09-24
信息查询
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