Invention Grant
- Patent Title: Semiconductor package and method of manufacturing the same
- Patent Title (中): 半导体封装及其制造方法
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Application No.: US12751741Application Date: 2010-03-31
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Publication No.: US08248803B2Publication Date: 2012-08-21
- Inventor: Jyh-Rong Lin , Ming Lu
- Applicant: Jyh-Rong Lin , Ming Lu
- Applicant Address: HK Shatin, New Territories
- Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
- Current Assignee Address: HK Shatin, New Territories
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced.
Public/Granted literature
- US20110242765A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2011-10-06
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