公开(公告)号：US06605525B2

公开(公告)日：2003-08-12

申请号：US09846643

申请日：2001-05-01

申请人： Szu-Wei Lu ,  Ming Lu ,  Jyh-Rong Lin

发明人： Szu-Wei Lu ,  Ming Lu ,  Jyh-Rong Lin

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L21/76885 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

摘要： A method for forming a wafer level package incorporating a multiplicity of elastomeric blocks as stress buffering layer and package formed are described. The method incorporates the step of forming metal lines in-between the plurality of IC dies on a wafer during the same process used for forming the metal vias. The metal lines are subsequently removed by either a mechanical method such as dicing with a diamond saw or by a chemical method such as wet etching. The method allows the fabrications of a wafer level package that has a multiplicity of elastomeric blocks formed on top as stress buffering layer without the CTE mismatch problem with other layers on the wafer.

公开(公告)号：US08248803B2

公开(公告)日：2012-08-21

申请号：US12751741

申请日：2010-03-31

申请人： Jyh-Rong Lin ,  Ming Lu

发明人： Jyh-Rong Lin ,  Ming Lu

IPC分类号： H05K7/20

CPC分类号： H01L23/3677 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： The subject invention relates to a semiconductor package and method of manufacturing the same. The semiconductor package of the subject invention comprises a substrate with a through hole penetrating therethrough; a semiconductor chip positioned on the substrate covering the through hole; and a thermal conductive device filling the through hole and contacting the semiconductor chip. According to the subject invention, the thermal resistance in the structure of the semiconductor package is substantially reduced and thus desirable performance of heat spreading or dissipation is achieved. In addition, the production cost and size of the semiconductor package are also reduced.

摘要翻译： 本发明涉及一种半导体封装及其制造方法。 本发明的半导体封装包括具有穿透其中的通孔的基板; 位于所述基板上的覆盖所述通孔的半导体芯片; 以及填充所述通孔并接触所述半导体芯片的导热装置。 根据本发明，半导体封装的结构中的热阻大大降低，从而实现了热扩散或散热所需的性能。 此外，半导体封装的制造成本和尺寸也降低。

公开(公告)号：US20140257771A1

公开(公告)日：2014-09-11

申请号：US13978709

申请日：2011-11-30

申请人： Ming Lu

发明人： Ming Lu

IPC分类号： G06F17/50

CPC分类号： G06F17/5009 ,  B64D15/20

摘要： The present invention is related to a numerical simulation method for aircraft flight-icing. This invention mainly includes an algorithm for velocity decomposition on the water film in simulating the air-supercooled water droplets movement using the single fluid two-phase flows system; an algorithm for tracking the icing interface and obtaining the temperature distribution inside the ice layer using the grid refinement scheme; the computing procedure using above-mentioned algorithms based on the fixed computing grid.

摘要翻译： 本发明涉及飞机飞行飞行的数值模拟方法。 本发明主要包括使用单流体两相流系统模拟空气过冷水滴运动的水膜速度分解算法; 一种用于跟踪结冰界面并使用网格细化方案获得冰层内的温度分布的算法; 基于固定计算网格的上述算法的计算程序。

公开(公告)号：US08805655B2

公开(公告)日：2014-08-12

申请号：US13188484

申请日：2011-07-22

申请人： Ming Lu

发明人： Ming Lu

IPC分类号： G06F7/60 ,  G06F17/10

CPC分类号： G06F17/5009 ,  G06F2217/16

摘要： Numerical methods for simulating subsonic flows and solving inverse problems based on the new two-dimensional Euler equations in Lagrangian formulation. A transformation to derive the Euler equations in Lagrangian plane to simplify the computational grid and to minimize the numerical diffusion caused by the convective flux. Constructed is a numerical scheme, the dimensional-splitting with hybrid upwind flux operators, where the two-dimensional Riemann problem was solved in the Lagrangian plane. The method, solving the inverse geometry shape design problem in Lagrangian plane, gives the flow filed results and the geometry shape concurrently.

摘要翻译： 基于拉格朗日公式的新的二维欧拉方程模拟亚音速流和求解逆问题的数值方法。 导出拉格朗日平面中的欧拉方程的简化计算网格和最小化由对流通量引起的数值扩散的转换。 构造是一种数值方案，具有混合逆风通量算子的维数分解，其中二维黎曼问题在拉格朗日平面中得到解决。 该方法解决了拉格朗日平面中的逆几何形状设计问题，同时给出了流场结果和几何形状。

公开(公告)号：US08691094B2

公开(公告)日：2014-04-08

申请号：US13141082

申请日：2010-11-04

申请人： Ming Lu

发明人： Ming Lu

IPC分类号： C02F3/28 ,  C02F11/04 ,  C02F9/14

CPC分类号： C02F3/28 ,  B09B3/00 ,  C02F1/24 ,  C02F3/305 ,  C02F2103/005 ,  C12M21/04 ,  C12M45/04 ,  Y02E50/343 ,  Y02W30/20 ,  Y02W30/47

摘要： A method and system for treating domestic sewage and organic garbage are provided. The method comprises the steps of: multi-phase separation, retting, generating sewage gas, and optional biological denitrification and dephosphorization, which can convert the domestic sewage and organic garbage into clear water, sewage gas, organic manure and sludge. The system comprises a multi-phase separation device, a retting device, a sewage gas generating device and a biological denitrification and dephosphorization device, which can treat the domestic sewage and organic garbage effectively and environmental friendly to achieve a reduction in pollution emission.

摘要翻译： 提供了一种处理生活污水和有机垃圾的方法和系统。 该方法包括以下步骤：多相分离，回渗，生成污水，可选的生物脱氮脱磷，可将生活污水和有机垃圾转化为清水，污水，有机肥和污泥。 该系统包括多相分离装置，浸取装置，污水气体发生装置和生物脱氮脱磷装置，能有效地对生活污水和有机垃圾进行有效的环保处理，实现污染物排放的减少。

公开(公告)号：US08373183B2

公开(公告)日：2013-02-12

申请号：US13031629

申请日：2011-02-22

申请人： Shan Mei Wan ,  Chang Shu Lee ,  Ming Lu

发明人： Shan Mei Wan ,  Chang Shu Lee ,  Ming Lu

IPC分类号： H01L33/48 ,  H01L33/50 ,  H01L33/00 ,  F21S2/00

CPC分类号： H01L33/504 ,  H01L33/505 ,  H01L51/5036 ,  H01L51/524 ,  H01L51/5253 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.

摘要翻译： 一种用于安装在基板上的一个或多个发光二极管的发光二极管封装。 框架设置在基板的至少一部分上并基本上包围但不接触发光二极管。 该框架对于从发光二极管发出的光基本上是透明的，并且包括一个或多个第一波长转换材料。 可以是一种或多种荧光体的波长转换材料将在发射波长处发射的光的至少一部分转换成不同的波长。 盖子覆盖框架内的发光二极管。 覆盖层包括与波长转换材料浓度或转换光波长中的第一或多个波长转换材料不同的一个或多个第二波长转换材料或波长转换材料的组合。

公开(公告)号：US08042978B2

公开(公告)日：2011-10-25

申请号：US11806945

申请日：2007-06-05

申请人： Ming Lu ,  Chak Hau Charles Pang ,  Kai Chiu Adam Wu ,  Lei Shirley Shi

发明人： Ming Lu ,  Chak Hau Charles Pang ,  Kai Chiu Adam Wu ,  Lei Shirley Shi

IPC分类号： F21V29/00 ,  F21V21/26

CPC分类号： F21V29/83 ,  F21S4/20 ,  F21V14/02 ,  F21Y2107/50 ,  F21Y2115/10

摘要： A assembly includes at least a first and a second light emitting source for emission of light, and an air passage between the first and second light emitting sources to allow air flow therethrough for dissipation of heats generated by the light emitting sources.

摘要翻译： 组件包括用于发射光的至少第一和第二发光源，以及在第一和第二发光源之间的空气通道，以允许空气流过其中以散发由发光源产生的热量。

公开(公告)号：US07741424B2

公开(公告)日：2010-06-22

申请号：US11575098

申请日：2005-09-26

申请人： Ming Lu ,  Katsumi Yabusaki

发明人： Ming Lu ,  Katsumi Yabusaki

IPC分类号： C08G79/00 ,  B01D11/04 ,  C08B3/00 ,  C08B5/00 ,  C08B7/00 ,  C08B13/00

CPC分类号： C08B5/00 ,  B01J20/26 ,  B01J20/262 ,  B01J20/265 ,  C08B11/04 ,  C08B11/08 ,  C08B11/20 ,  C08B13/00

摘要： The present invention is directed to a phosphoric ester of 2,3-dihydroxypropyl cellulose or 3-(2,3-dihydroxypropoxy)-2-hydroxypropyl cellulose, the cellulose having optionally undergone partial carbamidation, and to a metal absorbent employing the ester, and to a metal-absorbing apparatus employing the metal adsorbent.The cellulose derivative phosphoric ester serves as a metal adsorbent which exhibits high metal adsorption performance and metal adsorption rate per unit weight; has high mechanical strength; effectively soften water or a similar liquid; removes heavy metals from wastewater or a similar liquid at remarkably high efficiency; has excellent processability and can be formed into a variety of shapes and thus is applicable within a wide range; and can readily be reutilized.

摘要翻译： 本发明涉及2,3-二羟基丙基纤维素或3-（2,3-二羟基丙氧基）-2-羟丙基纤维素的磷酸酯，该纤维素任选经历部分氨基甲酰化，以及使用该酯的金属吸收剂，以及 涉及使用金属吸附剂的金属吸收装置。 纤维素衍生物磷酸酯用作金属吸附剂，其具有高的金属吸附性能和每单位重量的金属吸附速率; 机械强度高; 有效地软化水或类似液体; 以非常高的效率从废水或类似液体中除去重金属; 具有优异的加工性，可以形成多种形状，因此适用范围广泛; 并且可以容易地重新利用。

公开(公告)号：US07688526B2

公开(公告)日：2010-03-30

申请号：US11654601

申请日：2007-01-18

申请人： Ming Lu ,  Lei Shi ,  Chak Hau Pang

发明人： Ming Lu ,  Lei Shi ,  Chak Hau Pang

IPC分类号： G02B17/00 ,  G02B13/18 ,  G02B3/00 ,  F21V7/00

CPC分类号： F21V5/04 ,  F21Y2115/10 ,  G02B19/0028 ,  G02B19/0066 ,  G02B27/144

摘要： A light-emitting assembly comprising a lens, a first optical source, a second optical source and a third optical source, wherein the lens is disposed forward of said first, second and third optical sources; the third optical source is intermediate the first and second optical sources; and the lens and the first, second and third optical sources are arranged so that light emitted from the first and second optical sources merges at the third optical source after undergoing internal reflection at the lens.

摘要翻译： 一种发光组件，包括透镜，第一光源，第二光源和第三光源，其中所述透镜设置在所述第一，第二和第三光源的前方; 第三光源位于第一和第二光源之间; 并且透镜和第一，第二和第三光源被布置成使得从第一和第二光源发射的光在透镜经历内部反射之后在第三光源处合并。

公开(公告)号：US20100033971A1

公开(公告)日：2010-02-11

申请号：US12188146

申请日：2008-08-07

申请人： Ming Lu ,  Kai Chiu Wu ,  Lei Shi ,  Lai Man Chau

发明人： Ming Lu ,  Kai Chiu Wu ,  Lei Shi ,  Lai Man Chau

IPC分类号： F21V29/02 ,  B29B7/00

CPC分类号： F21V7/09 ,  F21V29/505 ,  F21Y2115/10

摘要： A heat-dissipating reflector for a lighting device having a reflecting surface for reflecting light from a light emitting source of the lighting device, and a plurality of ventilation openings formed through the reflecting surface for dissipating heat generated by the light emitting source.

摘要翻译： 一种用于照明装置的散热反射器，具有用于反射来自照明装置的发光源的光的反射面，以及通过反射面形成的多个通风口，用于散发由发光源产生的热量。