Invention Grant
- Patent Title: Condenser microphone
- Patent Title (中): 冷凝器麦克风
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Application No.: US12651455Application Date: 2010-01-01
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Publication No.: US08249281B2Publication Date: 2012-08-21
- Inventor: Rui Zhang
- Applicant: Rui Zhang
- Applicant Address: CN Shenzhen US CA La Vezne
- Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.,American Audio Components Inc.
- Current Assignee Address: CN Shenzhen US CA La Vezne
- Priority: CN200920131473U 20090515
- Main IPC: H04R25/00
- IPC: H04R25/00

Abstract:
A condenser microphone is disclosed. The condenser microphone includes a substrate having a cavity, a backplate connected to the substrate, a diaphragm facing to the backplate, and an anchor supporting the diaphragm. A first gap is formed between the diaphragm and the backplate. A groove is arranged on the anchor and the diaphragm partially covers the groove. The diaphragm and the groove forms a second gap communicating with the first gap.
Public/Granted literature
- US20100290648A1 Condenser Microphone Public/Granted day:2010-11-18
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