Invention Grant
- Patent Title: Multilayer printed circuit board
- Patent Title (中): 多层印刷电路板
-
Application No.: US12697646Application Date: 2010-02-01
-
Publication No.: US08249402B2Publication Date: 2012-08-21
- Inventor: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant: Motoo Asai , Hiroaki Kodama , Kazuhito Yamada
- Applicant Address: JP Ogaki-shi
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP Ogaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2004-308782 20041022
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/10
Abstract:
A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.
Public/Granted literature
- US20100135611A1 MULTILAYER PRINTED CIRCUIT BOARD Public/Granted day:2010-06-03
Information query
