发明授权
- 专利标题: Releasing mechanism and leveling apparatus
- 专利标题(中): 释放机构和调平装置
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申请号: US11923848申请日: 2007-10-25
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公开(公告)号: US08250894B2公开(公告)日: 2012-08-28
- 发明人: Takashi Yoshioka
- 申请人: Takashi Yoshioka
- 申请人地址: JP Kanagawa
- 专利权人: Aida Engineering, Ltd.
- 当前专利权人: Aida Engineering, Ltd.
- 当前专利权人地址: JP Kanagawa
- 代理机构: McDermott Will & Emery LLP
- 优先权: JP2006-293421 20061030; JP2006-293422 20061030; JP2007-167606 20070626
- 主分类号: B21D1/02
- IPC分类号: B21D1/02 ; B21D3/02
摘要:
A release mechanism for use in a leveling apparatus that performs a leveling process on a work object that has been wound in a coil configuration as a result of the work object being passed between a front side work roll in contact with the front side surface of the work object and a back side work roll that is in contact with the back side surface of the work, wherein the releasing mechanism switches between a work clamp state that allows performance of the leveling process and a release state that releases the work object from the clamp state by displacing a work roll support member that supports one of the work rolls relative to the another support member to change a distance between the work rolls by utilizing rotational movement of an electric motor.
公开/授权文献
- US20080098786A1 RELEASING MECHANISM AND LEVELING APPARATUS 公开/授权日:2008-05-01
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