发明授权
- 专利标题： Implementing impedance gradient connector for board-to-board applications
- 专利标题（中）： 实现板对板应用的阻抗梯度连接器
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申请号： US12948049申请日： 2010-11-17
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公开(公告)号： US08251749B2公开(公告)日： 2012-08-28
- 发明人: John Richard Dangler , Matthew Stephen Doyle , Thomas Donald Kidd , Joseph Kuczynski , Kevin Albert Splittstoesser , Timothy Jerome Tofil
- 申请人： John Richard Dangler , Matthew Stephen Doyle , Thomas Donald Kidd , Joseph Kuczynski , Kevin Albert Splittstoesser , Timothy Jerome Tofil
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 代理商 Joan Pennington
- 主分类号： H01R13/66
- IPC分类号： H01R13/66
摘要：
A method and connector housing are provided for implementing an impedance gradient connector for board-to-board applications. The impedance gradient connector housing includes a plurality of impedance zones with a first impedance zone including a first mating face with a first Printed Circuit Board (PCB) and with a second impedance zone including a second mating face with a second PCB. Each of the respective predefined impedance zones including the first mating face and the second mating face include a selected impedance to minimize impedance mismatch with associated PCBs.
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