发明授权
- 专利标题： Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof
- 专利标题（中）： 具有具有径向段的引线框的集成电路封装系统及其制造方法
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申请号： US12488043申请日： 2009-06-19
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公开(公告)号： US08252634B2公开(公告)日： 2012-08-28
- 发明人: Zigmund Ramirez Camacho , Jose Alvin Caparas , Lionel Chien Hui Tay
- 申请人： Zigmund Ramirez Camacho , Jose Alvin Caparas , Lionel Chien Hui Tay
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley M. Chang
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfingers only on portions of the continuously decreasing widths; and encapsulating the integrated circuit device and the leadfingers with an encapsulation.
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