Invention Grant
US08253194B2 Structures for reducing dopant out-diffusion from implant regions in power devices 有权
用于减少功率器件中植入区域的掺杂物扩散的结构

  • Patent Title: Structures for reducing dopant out-diffusion from implant regions in power devices
  • Patent Title (中): 用于减少功率器件中植入区域的掺杂物扩散的结构
  • Application No.: US12212489
    Application Date: 2008-09-17
  • Publication No.: US08253194B2
    Publication Date: 2012-08-28
  • Inventor: James Pan
  • Applicant: James Pan
  • Applicant Address: US ME South Portland
  • Assignee: Fairchild Semiconductor Corporation
  • Current Assignee: Fairchild Semiconductor Corporation
  • Current Assignee Address: US ME South Portland
  • Main IPC: H01L29/66
  • IPC: H01L29/66
Structures for reducing dopant out-diffusion from implant regions in power devices
Abstract:
A semiconductor structure comprises a drift region of a first conductivity type in a semiconductor region. A well region of a second conductivity type is over the drift region. A source region of the first conductivity type is in an upper portion of the well region. A heavy body region of the second conductivity type extends in the well region. The heavy body region has a higher doping concentration than the well region. A first diffusion barrier region at least partially surrounds the heavy body region. A gate electrode is insulated from the semiconductor region by a gate dielectric.
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