Invention Grant
US08253194B2 Structures for reducing dopant out-diffusion from implant regions in power devices
有权
用于减少功率器件中植入区域的掺杂物扩散的结构
- Patent Title: Structures for reducing dopant out-diffusion from implant regions in power devices
- Patent Title (中): 用于减少功率器件中植入区域的掺杂物扩散的结构
-
Application No.: US12212489Application Date: 2008-09-17
-
Publication No.: US08253194B2Publication Date: 2012-08-28
- Inventor: James Pan
- Applicant: James Pan
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor structure comprises a drift region of a first conductivity type in a semiconductor region. A well region of a second conductivity type is over the drift region. A source region of the first conductivity type is in an upper portion of the well region. A heavy body region of the second conductivity type extends in the well region. The heavy body region has a higher doping concentration than the well region. A first diffusion barrier region at least partially surrounds the heavy body region. A gate electrode is insulated from the semiconductor region by a gate dielectric.
Public/Granted literature
- US20100065905A1 Structures and Methods for Reducing Dopant Out-diffusion from Implant Regions in Power Devices Public/Granted day:2010-03-18
Information query
IPC分类: