发明授权
- 专利标题： Electronic module
- 专利标题（中）： 电子模块
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申请号： US12123784申请日： 2008-05-20
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公开(公告)号： US08253241B2公开(公告)日： 2012-08-28
- 发明人: Stefan Landau , Erwin Huber , Josef Hoeglauer , Joachim Mahler , Tino Karczeweski
- 申请人： Stefan Landau , Erwin Huber , Josef Hoeglauer , Joachim Mahler , Tino Karczeweski
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 μm.
公开/授权文献
- US20090289354A1 ELECTRONIC MODULE 公开/授权日：2009-11-26
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