Invention Grant
- Patent Title: Photomask defect correcting method and device
- Patent Title (中): 光掩模缺陷校正方法及装置
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Application No.: US12733090Application Date: 2008-08-06
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Publication No.: US08257887B2Publication Date: 2012-09-04
- Inventor: Osamu Takaoka
- Applicant: Osamu Takaoka
- Applicant Address: JP
- Assignee: SII NanoTechnology Inc.
- Current Assignee: SII NanoTechnology Inc.
- Current Assignee Address: JP
- Agency: Adams & Wilks
- Priority: JP2007-210362 20070810
- International Application: PCT/JP2008/064121 WO 20080806
- International Announcement: WO2009/022603 WO 20090219
- Main IPC: G03F1/72
- IPC: G03F1/72 ; G03F1/74

Abstract:
A photomask defect correction method for correcting a defect of a photomask. A defect in a portion of a photomask to be corrected is observed and information of the observed defect for performing correction of the defect is acquired. The observed defect is corrected in accordance with the acquired defect information by irradiating the observed defect with a focused ion beam from an ion beam irradiation system having a gas field ion source that generates rare gas ions for forming the focused ion beam.
Public/Granted literature
- US20100178601A1 PHOTOMASK DEFECT CORRECTING METHOD AND DEVICE Public/Granted day:2010-07-15
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