发明授权
- 专利标题： Acoustic wave device, duplexer, communication module, communication apparatus, and manufacturing method for acoustic wave device
- 专利标题（中）： 声波装置，双工器，通信模块，通信装置和声波装置的制造方法
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申请号： US12608397申请日： 2009-10-29
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公开(公告)号： US08258891B2公开(公告)日： 2012-09-04
- 发明人: Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
- 申请人： Michio Miura , Suguru Warashina , Takashi Matsuda , Shogo Inoue , Kazunori Inoue , Satoru Matsuda
- 申请人地址： JP Tokyo
- 专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人： Taiyo Yuden Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Chen Yoshimura LLP
- 优先权： JP2009-046294 20090227
- 主分类号： H03H9/25
- IPC分类号： H03H9/25 ; H03H9/15 ; H03H9/70 ; H03H9/72 ; H03H3/02 ; H03H3/08 ; H03H3/04 ; H03H3/10
摘要：
An acoustic wave device includes a piezoelectric substrate, interdigital electrodes arranged on the piezoelectric substrate, a first dielectric element arranged between the interdigital electrodes, a second dielectric element that covers the interdigital electrodes and the first dielectric element, and an adjustment element that has been formed on the first dielectric element. The adjustment element has been formed from a material whose specific gravity is greater than that of the first dielectric element and that of the second dielectric element.
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