发明授权
- 专利标题: Multi-gate device having a T-shaped gate structure
- 专利标题(中): 具有T形门结构的多门装置
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申请号: US12032603申请日: 2008-02-15
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公开(公告)号: US08264048B2公开(公告)日: 2012-09-11
- 发明人: Willy Rachmady , Uday Shah , Jack T. Kavalieros
- 申请人: Willy Rachmady , Uday Shah , Jack T. Kavalieros
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Cool Patent, P.C.
- 代理商 Joseph P. Curtin
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/336
摘要:
A multi-gate device having a T-shaped gate structure is generally described. In one example, an apparatus includes a semiconductor substrate, at least one multi-gate fin coupled with the semiconductor substrate, the multi-gate fin having a gate region, a source region, and a drain region, the gate region being positioned between the source and drain regions, a gate dielectric coupled to the gate region of the multi-gate fin, a gate electrode coupled to the gate dielectric, the gate electrode having a first thickness and a second thickness, the second thickness being greater than the first thickness, a first spacer dielectric coupled to a portion of the gate electrode having the first thickness, and a second spacer dielectric coupled to the first spacer dielectric and coupled to the gate electrode where the second spacer dielectric is coupled to a portion of the gate electrode having the second thickness.
公开/授权文献
- US20090206406A1 MULTI-GATE DEVICE HAVING A T-SHAPED GATE STRUCTURE 公开/授权日:2009-08-20
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