发明授权
- 专利标题： Integrated circuit packaging system with encapsulated via and method of manufacture thereof
- 专利标题（中）： 具有封装通孔的集成电路封装系统及其制造方法
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申请号： US12563514申请日： 2009-09-21
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公开(公告)号： US08264091B2公开(公告)日： 2012-09-11
- 发明人: NamJu Cho , HeeJo Chi , HanGil Shin
- 申请人： NamJu Cho , HeeJo Chi , HanGil Shin
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Mikio Ishimaru; Stanley M. Chang
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/44
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit over the substrate; attaching a buffer interconnect to and over the substrate; forming an encapsulation over the substrate covering the buffer interconnect and the integrated circuit; and forming a via in the encapsulation and to the buffer interconnect.
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