发明授权
- 专利标题： Heat sink and laser diode
- 专利标题（中）： 散热片和激光二极管
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申请号： US12128142申请日： 2008-05-28
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公开(公告)号： US08264841B2公开(公告)日： 2012-09-11
- 发明人: Kenji Sasaki , Hidekazu Kawanishi , Yuichi Hamaguchi
- 申请人： Kenji Sasaki , Hidekazu Kawanishi , Yuichi Hamaguchi
- 申请人地址： JP Tokyo
- 专利权人： Sony Corporation
- 当前专利权人： Sony Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： SNR Denton US LLP
- 优先权： JP2007-144640 20070531
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; H05K1/00 ; H05K1/03 ; H05K1/02 ; H05K1/16 ; F28D15/00
摘要：
The present invention is directed to improve reliability by preventing deterioration in the structure of an inner wall of a water channel caused by galvanic corrosion. A heat sink in which a water channel of a cooling fluid is formed by stacking and bonding a plurality of thin plates, in which a surface in the water channel is made of the same metal material except for at least an end of a bonded part of the thin plates.
公开/授权文献
- US20080298018A1 HEAT SINK AND LASER DIODE 公开/授权日：2008-12-04
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