发明授权
- 专利标题： Selective electrochemical accelerator removal
- 专利标题（中）： 选择性电化学促进剂去除
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申请号： US12860787申请日： 2010-08-20
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公开(公告)号： US08268154B1公开(公告)日： 2012-09-18
- 发明人: Steven T. Mayer , John S. Drewery , Richard S. Hill , Timothy M. Archer , Avishai Kepten
- 申请人： Steven T. Mayer , John S. Drewery , Richard S. Hill , Timothy M. Archer , Avishai Kepten
- 申请人地址： US CA San Jose
- 专利权人： Novellus Systems, Inc.
- 当前专利权人： Novellus Systems, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Weaver Austin Villeneuve & Sampson LLP
- 主分类号： C25D5/02
- IPC分类号： C25D5/02
摘要：
Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.
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