发明授权
- 专利标题： Method of semiconductor device protection
- 专利标题（中）： 半导体器件保护方法
-
申请号： US13240508申请日： 2011-09-22
-
公开(公告)号： US08268670B2公开(公告)日： 2012-09-18
- 发明人: Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
- 申请人： Kazuhiro Tashiro , Keisuke Fukuda , Naohito Kohashi , Shigeyuki Maruyama
- 申请人地址： JP Yokohama
- 专利权人： Fujitsu Semiconductor Limited
- 当前专利权人： Fujitsu Semiconductor Limited
- 当前专利权人地址： JP Yokohama
- 代理机构： Westerman, Hattori, Daniels & Adrian, LLP
- 优先权： JP2003-348796 20031007
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
公开/授权文献
- US20120005875A1 METHOD OF SEMICONDUCTOR DEVICE PROTECTION 公开/授权日：2012-01-12
信息查询
IPC分类:
