Semiconductor device packaging structure
    2.
    发明授权
    Semiconductor device packaging structure 有权
    半导体器件封装结构

    公开(公告)号:US08164181B2

    公开(公告)日:2012-04-24

    申请号:US12872131

    申请日:2010-08-31

    IPC分类号: H01L23/12

    摘要: A semiconductor device packaging structure is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译: 公开了一种半导体器件封装结构,其可以提高半导体器件的性能测试的可靠性,并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件,所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后,突出部分位于半导体器件中的自由区域中,并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

    METHOD OF SEMICONDUCTOR DEVICE PROTECTION
    6.
    发明申请
    METHOD OF SEMICONDUCTOR DEVICE PROTECTION 有权
    半导体器件保护方法

    公开(公告)号:US20120005875A1

    公开(公告)日:2012-01-12

    申请号:US13240508

    申请日:2011-09-22

    IPC分类号: B23P11/00

    摘要: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译: 公开了一种用于保护半导体器件的方法,其可以提高半导体器件的性能测试的可靠性,并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件,所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后,突出部分位于半导体器件中的自由区域中,并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。

    Method of semiconductor device protection
    8.
    发明授权
    Method of semiconductor device protection 有权
    半导体器件保护方法

    公开(公告)号:US08268670B2

    公开(公告)日:2012-09-18

    申请号:US13240508

    申请日:2011-09-22

    IPC分类号: H01L21/44

    摘要: A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.

    摘要翻译: 公开了一种用于保护半导体器件的方法,其可以提高半导体器件的性能测试的可靠性,并防止在运输或包装期间对半导体器件的损坏。 由于包含半导体芯片和具有不同高度的电气部件,所以具有高度不均匀性的半导体器件附着IC盖。 IC盖包括突出部分和基部。 在安装到半导体器件之后,突出部分位于半导体器件中的自由区域中,并且基底部分由与半导体芯片和半导体器件中的电气部件分离的突起支撑。 IC盖可拆卸地附接到半导体器件。