Invention Grant
US08268938B2 Maleimide based compound, composition for forming board, and board fabricated using the same
有权
马来酰亚胺基化合物，用于形成板的组合物和使用其制造的板
- Patent Title: Maleimide based compound, composition for forming board, and board fabricated using the same
- Patent Title (中): 马来酰亚胺基化合物，用于形成板的组合物和使用其制造的板
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Application No.: US12542460Application Date: 2009-08-17
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Publication No.: US08268938B2Publication Date: 2012-09-18
- Inventor: Kalinina Fedosya , Myung-Sup Jung , Chung-Kun Cho , Jae-Jun Lee , Kwang-Hee Kim
- Applicant: Kalinina Fedosya , Myung-Sup Jung , Chung-Kun Cho , Jae-Jun Lee , Kwang-Hee Kim
- Applicant Address: KR KR KR
- Assignee: Samsung Electronics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.,Samsung Fine Chemicals Co., Ltd.,Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR KR KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0016502 20090226
- Main IPC: C08L67/00
- IPC: C08L67/00 ; C08L77/00
Abstract:
Disclosed is a composition for forming a board. The composition includes a maleimide-based compound including at least three maleimide groups and a liquid crystalline polymer or oligomer. A prepreg and a board are each fabricated using the composition.
Public/Granted literature
- US20100215973A1 MALEIMIDE BASED COMPOUND, COMPOSITION FOR FORMING BOARD, AND BOARD FABRICATED USING THE SAME Public/Granted day:2010-08-26
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