Invention Grant
- Patent Title: Flexible circuit structure
- Patent Title (中): 灵活的电路结构
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Application No.: US12189206Application Date: 2008-08-11
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Publication No.: US08269112B2Publication Date: 2012-09-18
- Inventor: Yuan-Chang Lee , Yu-Hua Chen , Ying-Ching Shih , Cheng-Ta Ko
- Applicant: Yuan-Chang Lee , Yu-Hua Chen , Ying-Ching Shih , Cheng-Ta Ko
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW97100866A 20080109
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09

Abstract:
A circuit structure and a fabrication method thereof manly use a plurality of wires to connect in series a plurality of pads to form a stretchable circuit. Each of the wires has a first end, a second end and an intermediate segment located between the first end and the second end, wherein the first end and the second end are respectively connected to different pads, and the position of the intermediate segment is higher than the positions of the first end and the second end. Since the connection manner of the wires and the pads has 3-D freedoms, the circuit structure can withstand both horizontal and vertical deformations and has an outstanding reliability.
Public/Granted literature
- US20090173529A1 CIRCUIT STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2009-07-09
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