Invention Grant
US08269300B2 Apparatus and method for using spacer paste to package an image sensor
有权
用于使用间隔膏来封装图像传感器的装置和方法
- Patent Title: Apparatus and method for using spacer paste to package an image sensor
- Patent Title (中): 用于使用间隔膏来封装图像传感器的装置和方法
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Application No.: US12111763Application Date: 2008-04-29
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Publication No.: US08269300B2Publication Date: 2012-09-18
- Inventor: Yeh-An Chien , Wei-Feng Lin
- Applicant: Yeh-An Chien , Wei-Feng Lin
- Applicant Address: US CA Santa Clara
- Assignee: OmniVision Technologies, Inc.
- Current Assignee: OmniVision Technologies, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lathrop & Gage LLP
- Main IPC: H01L31/0203
- IPC: H01L31/0203 ; H01L31/18
Abstract:
A packaged image sensor assembly utilizes a spacer paste to control the height of a transparent window above an image sensor die to provide safe wire bond clearance. A dam structure is used to control the height of the transparent window. The dam may be formed either entirely from spacer paste or by depositing the spacer paste on an underlying patterned mesa. An additional encapsulant is provided outside of the dam to encapsulate wirebonds and provide additional protection from moisture permeation.
Public/Granted literature
- US20090267170A1 Apparatus and Method For Using Spacer Paste to Package an Image Sensor Public/Granted day:2009-10-29
Information query
IPC分类:
