发明授权
- 专利标题: Semiconductor device and method of manufacturing semiconductor device
- 专利标题(中): 半导体装置及其制造方法
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申请号: US12134363申请日: 2008-06-06
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公开(公告)号: US08269315B2公开(公告)日: 2012-09-18
- 发明人: Kazumasa Tanida , Masahiro Sekiguchi , Kenji Takahashi
- 申请人: Kazumasa Tanida , Masahiro Sekiguchi , Kenji Takahashi
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Turocy & Watson, LLP
- 优先权: JP2007-151151 20070607
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/768
摘要:
A semiconductor device 1 has a through hole 3 formed in a second substrate 2. On the front surface of the semiconductor substrate 2, a first insulating layer 4 is coated having an opening 4a of the same diameter as that of the through hole 3, and a first wiring layer 5 is formed on the first insulating layer 4. Further, near the first wiring layer 5, the through hole 3 and a through connection portion constituted of a third insulating layer 8 formed on the inner surface and the like and a third wiring layer 9 filled and formed in the through hole 3 are formed. In addition, a second wiring layer 7 internally contacting the through connection portion is electrically connected with the first wiring layer 5. Between the inner surface of the through hole 3 and the first wiring layer 5, a second insulating layer 6 intervenes so that the first wiring layer 5 is separated from the third wiring layer 9 filled and formed in the through hole 3.