公开(公告)号：US07888778B2

公开(公告)日：2011-02-15

申请号：US12207288

申请日：2008-09-09

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/11

摘要： A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.

摘要翻译： 半导体器件包括具有通孔的半导体衬底。 在半导体衬底的第一表面上形成有源层。 通孔的内壁表面，由有源层封闭的通孔的底表面和半导体衬底的第二表面被绝缘层覆盖。 在存在于通孔底面的绝缘层中形成第一开口。 在存在于半导体基板的第二表面上的绝缘层中形成第二开口。 第一布线层由贯通孔形成在半导体基板的第二面上。 第二布线层形成为通过第二开口连接到第二表面。

公开(公告)号：US20090065906A1

公开(公告)日：2009-03-12

申请号：US12207288

申请日：2008-09-09

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/11

摘要： A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.

摘要翻译： 半导体器件包括具有通孔的半导体衬底。 在半导体衬底的第一表面上形成有源层。 通孔的内壁表面，由有源层封闭的通孔的底表面和半导体衬底的第二表面被绝缘层覆盖。 在存在于通孔底面的绝缘层中形成第一开口。 在存在于半导体基板的第二表面上的绝缘层中形成第二开口。 第一布线层由贯通孔形成在半导体基板的第二面上。 第二布线层形成为通过第二开口连接到第二表面。

公开(公告)号：US08269315B2

公开(公告)日：2012-09-18

申请号：US12134363

申请日：2008-06-06

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Kenji Takahashi

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Kenji Takahashi

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05124 ,  H01L2224/05186 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05681 ,  H01L2224/05684 ,  H01L2224/1191 ,  H01L2224/13022 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2224/05099 ,  H01L2924/01074 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/013 ,  H01L2924/01014 ,  H01L2924/01029

摘要： A semiconductor device 1 has a through hole 3 formed in a second substrate 2. On the front surface of the semiconductor substrate 2, a first insulating layer 4 is coated having an opening 4a of the same diameter as that of the through hole 3, and a first wiring layer 5 is formed on the first insulating layer 4. Further, near the first wiring layer 5, the through hole 3 and a through connection portion constituted of a third insulating layer 8 formed on the inner surface and the like and a third wiring layer 9 filled and formed in the through hole 3 are formed. In addition, a second wiring layer 7 internally contacting the through connection portion is electrically connected with the first wiring layer 5. Between the inner surface of the through hole 3 and the first wiring layer 5, a second insulating layer 6 intervenes so that the first wiring layer 5 is separated from the third wiring layer 9 filled and formed in the through hole 3.

摘要翻译： 半导体器件1具有形成在第二衬底2中的通孔3.在半导体衬底2的正面上涂覆第一绝缘层4，其具有与通孔3直径相同的开口4a， 在第一绝缘层4上形成第一布线层5.此外，在第一布线层5附近，形成有内表面等的由第三绝缘层8构成的通孔3和贯通连接部， 形成在通孔3中填充并形成的布线层9。 此外，内部与贯通连接部接触的第二布线层7与第一布线层5电连接。在通孔3的内表面和第一布线层5之间，介入第二绝缘层6， 布线层5与填充并形成在通孔3中的第三布线层9分离。

公开(公告)号：US08228426B2

公开(公告)日：2012-07-24

申请号：US12511099

申请日：2009-07-29

申请人： Mie Matsuo ,  Atsuko Kawasaki ,  Kenji Takahashi ,  Masahiro Sekiguchi ,  Kazumasa Tanida

发明人： Mie Matsuo ,  Atsuko Kawasaki ,  Kenji Takahashi ,  Masahiro Sekiguchi ,  Kazumasa Tanida

IPC分类号： H04N5/225 ,  H01L21/00 ,  H01L31/062

CPC分类号： H04N5/2257 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/02372 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor package includes a solid-state imaging element, electrode pad, through-hole electrode, and light-transmitting substrate. The solid-state imaging element is formed on the first main surface of a semiconductor substrate. The electrode pad is formed on the first main surface of the semiconductor substrate. The through-hole electrode is formed to extend through the semiconductor substrate between the first main surface and a second main surface opposite to the electrode pad formed on the first main surface. The light-transmitting substrate is placed on a patterned adhesive to form a hollow on the solid-state imaging element. The thickness of the semiconductor substrate below the hollow when viewed from the light-transmitting substrate is larger than that of the semiconductor substrate below the adhesive.

摘要翻译： 半导体封装包括固态成像元件，电极焊盘，通孔电极和透光衬底。 固态成像元件形成在半导体衬底的第一主表面上。 电极焊盘形成在半导体衬底的第一主表面上。 通孔电极形成为在第一主表面和与形成在第一主表面上的电极焊盘相对的第二主表面之间延伸穿过半导体衬底。 将透光基板放置在图案化的粘合剂上以在固态成像元件上形成中空。 从透光性基板观察时，半导体衬底在中空部下方的厚度大于粘合剂下方的半导体衬底的厚度。

公开(公告)号：US20090284631A1

公开(公告)日：2009-11-19

申请号：US12511099

申请日：2009-07-29

申请人： Mie MATSUO ,  Atsuko Kawasaki ,  Kenji Takahashi ,  Masahiro Sekiguchi ,  Kazumasa Tanida

发明人： Mie MATSUO ,  Atsuko Kawasaki ,  Kenji Takahashi ,  Masahiro Sekiguchi ,  Kazumasa Tanida

IPC分类号： H04N5/225 ,  H01L31/0232

CPC分类号： H04N5/2257 ,  H01L23/481 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/02372 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor package includes a solid-state imaging element, electrode pad, through-hole electrode, and light-transmitting substrate. The solid-state imaging element is formed on the first main surface of a semiconductor substrate. The electrode pad is formed on the first main surface of the semiconductor substrate. The through-hole electrode is formed to extend through the semiconductor substrate between the first main surface and a second main surface opposite to the electrode pad formed on the first main surface. The light-transmitting substrate is placed on a patterned adhesive to form a hollow on the solid-state imaging element. The thickness of the semiconductor substrate below the hollow when viewed from the light-transmitting substrate is larger than that of the semiconductor substrate below the adhesive.

摘要翻译： 半导体封装包括固态成像元件，电极焊盘，通孔电极和透光衬底。 固态成像元件形成在半导体衬底的第一主表面上。 电极焊盘形成在半导体衬底的第一主表面上。 通孔电极形成为在第一主表面和与形成在第一主表面上的电极焊盘相对的第二主表面之间延伸穿过半导体衬底。 将透光基板放置在图案化的粘合剂上以在固态成像元件上形成中空。 从透光性基板观察时，半导体衬底在中空部下方的厚度大于粘合剂下方的半导体衬底的厚度。

公开(公告)号：US20120049312A1

公开(公告)日：2012-03-01

申请号：US13212644

申请日：2011-08-18

申请人： Kazumasa TANIDA ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Tsuyoshi Matsumura ,  Hideo Numata ,  Mari Otsuka ,  Naoko Yamaguchi ,  Takashi Shirono ,  Satoshi Hongo

发明人： Kazumasa TANIDA ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Tsuyoshi Matsumura ,  Hideo Numata ,  Mari Otsuka ,  Naoko Yamaguchi ,  Takashi Shirono ,  Satoshi Hongo

IPC分类号： H01L27/146 ,  H01L29/06 ,  H01L21/30

CPC分类号： H01L27/1464 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： According to an embodiment, an active layer is formed on a first surface of a semiconductor substrate, a wiring layer is formed on the active layer, and an insulating layer is formed covering the wiring layer. The first surface of the semiconductor substrate is bonded to a support substrate via the insulating layer, and the semiconductor substrate bonded to the support substrate is thinned leaving the semiconductor substrate having a predetermined thickness which covers the active layer from a second surface. At least a part of area of the thinned semiconductor substrate is removed to expose the active layer.

摘要翻译： 根据实施例，在半导体衬底的第一表面上形成有源层，在有源层上形成布线层，并且覆盖布线层形成绝缘层。 半导体衬底的第一表面经由绝缘层接合到支撑衬底，并且结合到支撑衬底的半导体衬底被薄化，从第二表面离开具有预定厚度的半导体衬底覆盖有源层。 去除减薄的半导体衬底的面积的至少一部分以暴露活性层。

公开(公告)号：US07888760B2

公开(公告)日：2011-02-15

申请号：US12249438

申请日：2008-10-10

申请人： Hitoshi Sugiyama ,  Atsuko Yamashita ,  Kazutaka Akiyama ,  Susumu Harada ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Kazumasa Tanida ,  Chiaki Takubo ,  Hiroshi Yoshikawa ,  Akihiro Hori

发明人： Hitoshi Sugiyama ,  Atsuko Yamashita ,  Kazutaka Akiyama ,  Susumu Harada ,  Masahiro Sekiguchi ,  Masayuki Dohi ,  Kazumasa Tanida ,  Chiaki Takubo ,  Hiroshi Yoshikawa ,  Akihiro Hori

IPC分类号： H01L27/146 ,  H01L31/0216

CPC分类号： H01L27/14634 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14636 ,  H01L27/14685 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014

摘要： A solid state imaging device includes: an imaging device substrate with an imaging device section formed on a first major surface side thereof; a backside interconnect electrode provided on a second major surface side of the imaging device substrate and electrically connected to the imaging device section, the second major surface being on the opposite side of the first major surface; a circuit substrate provided with a circuit substrate electrode opposed to the second major surface; a connecting portion electrically connecting the backside interconnect electrode to the circuit substrate electrode; and a light shielding layer provided coplanar with the backside interconnect electrode or on the circuit substrate side of the backside interconnect electrode.

摘要翻译： 固态成像装置包括：具有形成在其第一主表面侧的成像装置部分的成像装置基板; 设置在成像器件基板的第二主表面侧并电连接到成像器件部分的背面互连电极，第二主表面在第一主表面的相对侧上; 电路基板，设置有与第二主表面相对的电路基板电极; 连接部，其将所述背面侧配线电极与所述电路基板电极电连接; 以及与背面配线电极共同设置的遮光层，或背面配线电极的电路基板侧。

公开(公告)号：US20090057844A1

公开(公告)日：2009-03-05

申请号：US12203389

申请日：2008-09-03

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi

IPC分类号： H01L21/768 ,  H01L23/538

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16 ,  H01L2924/00014

摘要： A semiconductor device 1 comprises a semiconductor substrate 2 having a through hole 3. A first insulation layer 4 having an opening 4a equal in diameter to the through hole 3 covers a front surface of the semiconductor substrate 2, and a first wiring layer 5 is formed thereon to cover the opening 4a. Further, a second insulation layer 6 is formed in the through hole 3 and on a rear surface of the semiconductor substrate 2. The second insulation layer 6 is formed to be in contact with an inner side of the first wiring layer 5 and has, in its contact portion, a plurality of small openings 6a smaller in diameter than the opening 4 of the first insulation layer 4. Further, a second wiring layer 7 is formed to fill the inside of the through hole 3, and the second wiring layer 7 is in contact with the inner side of the first wiring layer 5 via the small openings 6a of the second insulation layer 6.

摘要翻译： 半导体器件1包括具有通孔3的半导体衬底2.具有与通孔3直径相等的开口4a的第一绝缘层4覆盖半导体衬底2的前表面，形成第一布线层5 在其上以覆盖开口4a。 此外，在通孔3和半导体基板2的后表面上形成第二绝缘层6.第二绝缘层6形成为与第一布线层5的内侧接触，并且具有 其接触部分，直径小于第一绝缘层4的开口4的多个小开口6a。此外，形成第二布线层7以填充通孔3的内部，第二布线层7为 通过第二绝缘层6的小开口6a与第一布线层5的内侧接触。

公开(公告)号：US07808064B2

公开(公告)日：2010-10-05

申请号：US12508293

申请日：2009-07-23

申请人： Atsuko Kawasaki ,  Mie Matsuo ,  Ikuko Inoue ,  Masayuki Ayabe ,  Masahiro Sekiguchi ,  Kazumasa Tanida

发明人： Atsuko Kawasaki ,  Mie Matsuo ,  Ikuko Inoue ,  Masayuki Ayabe ,  Masahiro Sekiguchi ,  Kazumasa Tanida

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14636 ,  H01L2224/02372 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/13022 ,  H01L2224/13024 ,  H04N5/2257

摘要： An imaging element is formed on the first main surface of a semiconductor substrate. An external terminal is formed on the second main surface of the semiconductor substrate. A through-hole electrode is formed in a through hole formed in the semiconductor substrate. A first electrode pad is formed on the through-hole electrode in the first main surface. An interlayer insulating film is formed on the first electrode pad and on the first main surface. A second electrode pad is formed on the interlayer insulating film. A passivation film is formed on the second electrode pad and the interlayer insulating film, and has an opening which exposes a portion of the second electrode pad. A contact plug is formed between the first and second electrode pads in a region which does not overlap the opening when viewed in a direction perpendicular to the surface of the semiconductor substrate.

摘要翻译： 成像元件形成在半导体衬底的第一主表面上。 外部端子形成在半导体衬底的第二主表面上。 在形成在半导体衬底中的通孔中形成通孔电极。 第一电极焊盘形成在第一主表面中的通孔电极上。 在第一电极焊盘和第一主表面上形成层间绝缘膜。 在层间绝缘膜上形成第二电极焊盘。 在第二电极焊盘和层间绝缘膜上形成钝化膜，并且具有露出第二电极焊盘的一部分的开口。 当在垂直于半导体衬底的表面的方向观察时，在不与开口重叠的区域中，在第一和第二电极焊盘之间形成接触插塞。

公开(公告)号：US20090079020A1

公开(公告)日：2009-03-26

申请号：US12212754

申请日：2008-09-18

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Susumu Harada

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Susumu Harada

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L2224/02372 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13025 ,  H01L2924/00014 ,  H01L2924/16235 ,  H01L2224/05099

摘要： A semiconductor device includes a semiconductor substrate having a first surface in which a light-receiving portion and electrodes are provided. The semiconductor substrate has a penetrating wiring layer connecting the first surface and the second surface. A light-transmissive protective member is disposed on the semiconductor substrate so as to cover the first surface. A gap is provided between the semiconductor substrate and the light-transmissive protective member. A protective film is formed at a surface of the light-transmissive protective member. The protective film has an opening provided at a region corresponding to the light-receiving portion.

摘要翻译： 半导体器件包括具有其中设置有光接收部分和电极的第一表面的半导体衬底。 半导体衬底具有连接第一表面和第二表面的穿透布线层。 透光性保护构件设置在半导体衬底上以覆盖第一表面。 在半导体衬底和透光保护构件之间设置间隙。 在透光保护部件的表面形成有保护膜。 保护膜具有设置在与受光部对应的区域的开口部。