An interconnection component includes a plurality of through-substrate vias (TSVs) penetrating through a substrate. The plurality of TSVs includes an active TSV having a first end and a second end. The first end of the active TSV is electrically coupled to a signal-providing circuit. The second end of the active TSV is electrically coupled to an additional package component bonded to the interconnection component. The plurality of TSVs further includes a dummy TSV having a first end and a second end, wherein the first end is electrically coupled to the signal-providing circuit, and wherein the second end is open ended.