Invention Grant
US08270316B1 On-chip radio frequency (RF) interconnects for network-on-chip designs
有权
用于片上设计的片上射频(RF)互连
- Patent Title: On-chip radio frequency (RF) interconnects for network-on-chip designs
- Patent Title (中): 用于片上设计的片上射频(RF)互连
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Application No.: US12363182Application Date: 2009-01-30
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Publication No.: US08270316B1Publication Date: 2012-09-18
- Inventor: Mau-Chung F. Chang , Jason Cong , Adam Kaplan , Mishali Naik , Glenn Reinman , Eran Socher , Sai-Wang Tam , Chunyue Liu
- Applicant: Mau-Chung F. Chang , Jason Cong , Adam Kaplan , Mishali Naik , Glenn Reinman , Eran Socher , Sai-Wang Tam , Chunyue Liu
- Applicant Address: US CA Oakland
- Assignee: The Regents of the University of California
- Current Assignee: The Regents of the University of California
- Current Assignee Address: US CA Oakland
- Agency: Withrow & Terranova, P.L.L.C.
- Main IPC: H04L12/28
- IPC: H04L12/28

Abstract:
An on-chip Radio Frequency (RF) Interconnect (RF-I) for communication between internal circuit nodes of an integrated circuit is provided. In one embodiment, an integrated circuit is provided that includes an on-chip transmission line, a first circuit node associated with an RF transmitter connected to the transmission line, and a second circuit node associated with an RF receiver connected to the transmission line. In order to transmit data from the first circuit node to the second circuit node, the RF transmitter associated with the first circuit node modulates the data onto an RF carrier frequency to provide a modulated RF signal and transmits the modulated RF signal over the transmission line. The RF receiver associated with the second circuit node receives the modulated RF signal from the transmission line and demodulates the modulated RF signal to recover the data for the second circuit node.
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