发明授权
US08274154B2 Semiconductor device with interface peeling preventing rewiring layer
有权
具有界面剥离防护重新布线层的半导体器件
- 专利标题： Semiconductor device with interface peeling preventing rewiring layer
- 专利标题（中）： 具有界面剥离防护重新布线层的半导体器件
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申请号： US12926662申请日： 2010-12-02
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公开(公告)号： US08274154B2公开(公告)日： 2012-09-25
- 发明人: Kiyonori Watanabe
- 申请人： Kiyonori Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Oki Semiconductor Co., Ltd.
- 当前专利权人： Oki Semiconductor Co., Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Rabin & Berdo, P.C.
- 优先权： JP2006-192881 20060713
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
A semiconductor device which is capable of preventing interface peeling and a crack from occurring in the vicinity of the edge part of a rewiring layer is provided. The semiconductor device includes a semiconductor substrate, an electrode pad formed on the semiconductor substrate, a first insulation film formed on the semiconductor substrate having a first aperture which exposes the electrode pad, a first conductor film formed on the electrode pad and the first insulation film, an external electrode electrically connected to the first conductor film, and a sealing resin which covers the first conductor film and the first insulation film. The first conductor film includes a plurality of copper layers which are stacked so that an outer edge portion of the first conductor film has a stepped portion.
公开/授权文献
- US20110074032A1 Semiconductor device 公开/授权日：2011-03-31
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