发明授权
US08278148B2 Integrated circuit package system with leads separated from a die paddle
有权
集成电路封装系统，带有与管芯分离的引线
- 专利标题： Integrated circuit package system with leads separated from a die paddle
- 专利标题（中）： 集成电路封装系统，带有与管芯分离的引线
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申请号： US11854989申请日： 2007-09-13
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公开(公告)号： US08278148B2公开(公告)日： 2012-10-02
- 发明人: Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Lionel Chien Hui Tay , Zigmund Ramirez Camacho
- 申请人： Jeffrey D. Punzalan , Jairus Legaspi Pisigan , Lionel Chien Hui Tay , Zigmund Ramirez Camacho
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理机构： Ishimaru & Associates LLP
- 代理商 Miko Ishimaru; Stanley M. Chang
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.
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