发明授权
US08278151B2 Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip
失效
用于保持芯片的带状物，保持芯片状工件的方法，使用用于保持芯片的带状半导体器件的制造方法以及用于保持芯片的带的制造方法
- 专利标题： Tape for holding chip, method of holding chip-shaped workpiece, method of manufacturing semiconductor device using tape for holding chip, and method of manufacturing tape for holding chip
- 专利标题（中）： 用于保持芯片的带状物，保持芯片状工件的方法，使用用于保持芯片的带状半导体器件的制造方法以及用于保持芯片的带的制造方法
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申请号： US12969959申请日： 2010-12-16
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公开(公告)号： US08278151B2公开(公告)日： 2012-10-02
- 发明人: Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
- 申请人： Shuhei Murata , Takeshi Matsumura , Koji Mizuno , Fumiteru Asai
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2009-296116 20091225
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
The present invention aims to provide a tape for holding a chip that makes pasting and peeling of a chip-shaped workpiece easy. It is a tape for holding a chip having a configuration in which a pressure-sensitive adhesive layer is formed on a base material, wherein the pressure-sensitive adhesive layer has a chip-shaped workpiece pasting region onto which a chip-shaped workpiece is pasted and a frame pasting region onto which a mount frame is pasted, and that is used by pasting the mount frame to the frame pasting region, wherein the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the frame pasting region is 5 times or more the 180-degree peeling adhesive power of the pressure-sensitive adhesive layer to a silicon mirror wafer at the chip-shaped workpiece pasting region.
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