发明授权
- 专利标题： Led package module
- 专利标题（中）： LED封装模块
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申请号： US13404924申请日： 2012-02-24
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公开(公告)号： US08278671B2公开(公告)日： 2012-10-02
- 发明人: Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
- 申请人： Suk Ho Jung , Hyung Kun Kim , Hak Hwan Kim , Young Jin Lee , Ho Sun Paek
- 申请人地址： KR Gyunggi-Do
- 专利权人： Samsung LED Co., Ltd.
- 当前专利权人： Samsung LED Co., Ltd.
- 当前专利权人地址： KR Gyunggi-Do
- 代理机构： McDermott Will & Emery LLP
- 优先权： KR10-2008-0101265 20081015
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
An LED package module according to an aspect of the invention may include: a substrate having predetermined electrodes thereon; a plurality of LED chips mounted onto the substrate, separated from each other at predetermined intervals, and electrically connected to the electrodes; a first color resin portion molded around at least one of the plurality of LED chips; a second color resin portion molded around all of the LED chips except for the LED chip around which the first color resin portion is molded, and having a different color from the first color resin portion; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion.
公开/授权文献
- US20120211780A1 LED PACKAGE MODULE 公开/授权日：2012-08-23
信息查询
IPC分类:
