Invention Grant
- Patent Title: High density trench field effect transistor
- Patent Title (中): 高密度沟槽场效应晶体管
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Application No.: US12211654Application Date: 2008-09-16
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Publication No.: US08278702B2Publication Date: 2012-10-02
- Inventor: James Pan , Scott L. Hunt , Dean E. Probst , Hossein Paravi
- Applicant: James Pan , Scott L. Hunt , Dean E. Probst , Hossein Paravi
- Applicant Address: US ME South Portland
- Assignee: Fairchild Semiconductor Corporation
- Current Assignee: Fairchild Semiconductor Corporation
- Current Assignee Address: US ME South Portland
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor structure comprises trenches extending into a semiconductor region. Portions of the semiconductor region extend between adjacent trenches forming mesa regions. A gate electrode is in each trench. Well regions of a first conductivity type extend in the semiconductor region between adjacent trenches. Source regions of a second conductivity type are in the well regions. Heavy body regions of the first conductivity type are in the well regions. The source regions and the heavy body regions are adjacent trench sidewalls, and the heavy body regions extend over the source regions along the trench sidewalls to a top surface of the mesa regions.
Public/Granted literature
- US20100065904A1 High density trench field effect transistor Public/Granted day:2010-03-18
Information query
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