Invention Grant
- Patent Title: Low inductance power electronics assembly
- Patent Title (中): 低电感功率电子组件
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Application No.: US12632067Application Date: 2009-12-07
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Publication No.: US08279620B2Publication Date: 2012-10-02
- Inventor: Nicholas Hayden Herron , Brooks S. Mann , Mark D. Korich , Cindy Chou , David Tang , Douglas S. Carlson , Alan L. Barry
- Applicant: Nicholas Hayden Herron , Brooks S. Mann , Mark D. Korich , Cindy Chou , David Tang , Douglas S. Carlson , Alan L. Barry
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz P.C.
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
Public/Granted literature
- US20110069466A1 LOW INDUCTANCE POWER ELECTRONICS ASSEMBLY Public/Granted day:2011-03-24
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