Invention Grant
US08282736B2 Lower liner with integrated flow equalizer and improved conductance
有权
下层衬套具有集成流量均衡器和改进的电导率
- Patent Title: Lower liner with integrated flow equalizer and improved conductance
- Patent Title (中): 下层衬套具有集成流量均衡器和改进的电导率
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Application No.: US13401572Application Date: 2012-02-21
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Publication No.: US08282736B2Publication Date: 2012-10-09
- Inventor: James D. Carducci , Andrew Nguyen , Ajit Balakrishna , Michael C. Kutney
- Applicant: James D. Carducci , Andrew Nguyen , Ajit Balakrishna , Michael C. Kutney
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/52 ; C23C16/06 ; C23C16/22
Abstract:
A plasma processing chamber has a lower liner with an integrated flow equalizer. In an etching process, the processing gases may be unevenly drawn from the processing chamber which may cause an uneven etching of the substrate. The integrated flow equalizer is configured to equalize the flow of the processing gases evacuated from the chamber via the lower liner.
Public/Granted literature
- US20120145326A1 LOWER LINER WITH INTEGRATED FLOW EQUALIZER AND IMPROVED CONDUCTANCE Public/Granted day:2012-06-14
Information query
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