Invention Grant
US08283211B2 Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
有权
制造具有凹凸/基底散热器的半导体芯片组件和凸块中的双角腔的方法
- Patent Title: Method of making a semiconductor chip assembly with a bump/base heat spreader and a dual-angle cavity in the bump
- Patent Title (中): 制造具有凹凸/基底散热器的半导体芯片组件和凸块中的双角腔的方法
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Application No.: US12951066Application Date: 2010-11-22
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Publication No.: US08283211B2Publication Date: 2012-10-09
- Inventor: Charles W. C. Lin , Chia-Chung Wang
- Applicant: Charles W. C. Lin , Chia-Chung Wang
- Applicant Address: TW Taipei
- Assignee: Bridge Semiconductor Corporation
- Current Assignee: Bridge Semiconductor Corporation
- Current Assignee Address: TW Taipei
- Agency: Jackson IPG PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/12
Abstract:
A method of making a semiconductor chip assembly includes providing a bump and a ledge, wherein the bump includes first, second and third bent corners that shape a cavity, mounting an adhesive on the ledge including inserting the bump into an opening in the adhesive, mounting a conductive layer on the adhesive including aligning the bump with an aperture in the conductive layer, then flowing the adhesive between the bump and the conductive layer, solidifying the adhesive, then providing a conductive trace that includes a pad, a terminal and a selected portion of the ledge, providing a heat spreader that includes the bump, then mounting a semiconductor device on the bump within the cavity, electrically connecting the semiconductor device to the conductive trace and thermally connecting the semiconductor device to the heat spreader.
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