发明授权
- 专利标题： Microelectronic packages with enhanced heat dissipation and methods of manufacturing
- 专利标题（中）： 具有增强散热的微电子封装和制造方法
-
申请号： US12970729申请日： 2010-12-16
-
公开(公告)号： US08283758B2公开(公告)日： 2012-10-09
- 发明人: Hunt Hang Jiang
- 申请人： Hunt Hang Jiang
- 申请人地址： US CA San Jose
- 专利权人： Monolithic Power Systems, Inc.
- 当前专利权人： Monolithic Power Systems, Inc.
- 当前专利权人地址： US CA San Jose
- 代理机构： Perkins Coie LLP
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
Several embodiments of microelectronic packages with enhanced heat dissipation and associated methods of manufacturing are disclosed herein. In one embodiment, a microelectronic package includes a semiconductor die having a first side and a second side opposite the first side and a lead frame proximate the semiconductor die. The lead frame has a lead finger electrically coupled to the first side of the semiconductor die. The microelectronic package also includes an encapsulant at least partially encapsulating the semiconductor die and the lead frame. The encapsulant does not cover at least a portion of the second side of the semiconductor die.