Invention Grant
- Patent Title: Electrical interconnection structures and method
- Patent Title (中): 电互连结构及方法
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Application No.: US11343107Application Date: 2006-01-30
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Publication No.: US08285379B2Publication Date: 2012-10-09
- Inventor: Rajesh V. Iyer , William J. Taylor , Joseph F. Lessar , Mark D. Breyen , Daniel J. Koch
- Applicant: Rajesh V. Iyer , William J. Taylor , Joseph F. Lessar , Mark D. Breyen , Daniel J. Koch
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/00
- IPC: A61N1/00 ; H01G4/35
Abstract:
An electrical interconnect structure for an implantable medical device includes a feedthrough that has a pin extending therefrom. The pin defines a first end and a middle portion. A bonding surface is formed at the first end of the pin, and the bonding surface has a surface area greater than a cross-sectional area of the pin at its middle portion.
Public/Granted literature
- US20070179555A1 Electrical interconnection structures and method Public/Granted day:2007-08-02
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