Invention Grant
- Patent Title: Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners
- Patent Title (中): 具有用于空调的超导散热装置的增强型热电冷却器
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Application No.: US12931817Application Date: 2011-02-11
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Publication No.: US08286436B2Publication Date: 2012-10-16
- Inventor: I-Ming Lin , Fu-Hsing Hsieh
- Applicant: I-Ming Lin , Fu-Hsing Hsieh
- Agency: David and Raymond Patent Firm
- Agent Raymond Y. Chan
- Main IPC: F25B21/02
- IPC: F25B21/02
Abstract:
This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.
Public/Granted literature
- US20110132001A1 Enhanced thermoelectric cooler with superconductive heat-dissipative device for use in air-conditioners Public/Granted day:2011-06-09
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