A sensor arrangement has a sensor element. A contact element is in electrical contact on the one hand with the sensor element and on the other with contact pins. The contact element is insert moulded with a plastic body. Affixing positions to which the contact element has been affixed, and on which the contact element is exposed respectively have one collar made of plastic material which runs around the exposed areas of the contact element. A sensor arrangement results for which the cost of manufacture is lower than that of the prior art, while the same security against unwanted electrostatic discharging or against the formation of an unwanted short circuit remains.