发明授权
- 专利标题： Electromagnetic bandgap pattern structure, method of manufacturing the same, and security product using the same
- 专利标题（中）： 电磁带隙图案结构，制造方法及使用其的安全产品
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申请号： US12784356申请日： 2010-05-20
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公开(公告)号： US08289109B2公开(公告)日： 2012-10-16
- 发明人: Jong Won Yu , Won Gyu Lim , Hyeong Seok Jang , Dong Hoon Shin , Jin Ho Ryu , Hyun Mi Kim , Won Gyun Choe
- 申请人： Jong Won Yu , Won Gyu Lim , Hyeong Seok Jang , Dong Hoon Shin , Jin Ho Ryu , Hyun Mi Kim , Won Gyun Choe
- 申请人地址： KR Daejeon
- 专利权人： Korea Minting, Security Printing & ID Card Operating Corp.
- 当前专利权人： Korea Minting, Security Printing & ID Card Operating Corp.
- 当前专利权人地址： KR Daejeon
- 代理机构： Rabin & Berdo. P.C.
- 优先权： KR10-2009-0045159 20090522
- 主分类号： H01P1/203
- IPC分类号： H01P1/203 ; G03F7/20
摘要：
An electromagnetic bandgap (EBG) pattern structure includes a nonconductive substrate and a pattern assembly formed on the substrate. The EBG pattern structure also includes regularly arranged closed-loop patterns and open-loop patterns, both of which are made of a conductive material. The EBG pattern structure can be used to manufacture new security products by applying its frequency characteristics to securities or IDs and variously used in security technologies for preventing forgery and alteration because various security codes can be created by adjusting the variables of its EBG pattern.
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