Apparatus for recognizing security code having electromagnetic band-gap pattern
    3.
    发明授权
    Apparatus for recognizing security code having electromagnetic band-gap pattern 有权
    用于识别具有电磁带隙图案的安全码的装置

    公开(公告)号:US08146800B2

    公开(公告)日:2012-04-03

    申请号:US12794699

    申请日:2010-06-04

    IPC分类号: G06F17/00

    摘要: In an apparatus for recognizing a security code having an electromagnetic band gap (EBG) pattern which uses reflection and transmission characteristics of the EBG pattern, a voltage controlled oscillator generates a signal to a power divider, which divides the power of the signal into halves, and outputs a first signal through a waveguide to be incident on the EBG pattern. The waveguide receives a signal reflected from the EBG pattern and outputs the reflected signal to a phase detector. A circulator outputs the second signal to the phase detector, which detects the phase difference between the reflected signal and the second signal, and outputs phase difference data to a data control unit, which determines whether the security code having the EBG pattern is recognized using the phase difference data. In an alternate embodiment, the voltage control oscillator is controlled to sequentially generate signals using power difference data.

    摘要翻译: 在用于识别具有使用EBG图案的反射和传输特性的电磁带隙(EBG)模式的安全码的装置中,压控振荡器产生信号到功率分配器,功率分配器将信号的功率分成两半, 并且通过波导输出要入射到EBG图案上的第一信号。 波导接收从EBG图案反射的信号,并将反射信号输出到相位检测器。 循环器将第二信号输出到检测反射信号和第二信号之间的相位差的相位检测器,并将相位差数据输出到数据控制单元,数据控制单元确定是否使用EBG图案识别具有EBG图案的安全码 相位差数据。 在替代实施例中,控制电压控制振荡器以使用功率差数据顺序产生信号。

    APPARATUS FOR RECOGNIZING SECURITY CODE HAVING ELECTROMAGNETIC BAND-GAP PATTERN
    4.
    发明申请
    APPARATUS FOR RECOGNIZING SECURITY CODE HAVING ELECTROMAGNETIC BAND-GAP PATTERN 有权
    用于识别具有电磁带隙图案的安全码的装置

    公开(公告)号:US20110108617A1

    公开(公告)日:2011-05-12

    申请号:US12794699

    申请日:2010-06-04

    IPC分类号: G06F17/00

    摘要: In an apparatus for recognizing a security code having an electromagnetic band gap (EBG) pattern which uses reflection and transmission characteristics of the EBG pattern, a voltage controlled oscillator generates a signal to a power divider, which divides the power of the signal into halves, and outputs a first signal through a waveguide to be incident on the EBG pattern. The waveguide receives a signal reflected from the EBG pattern and outputs the reflected signal to a phase detector. A circulator outputs the second signal to the phase detector, which detects the phase difference between the reflected signal and the second signal, and outputs phase difference data to a data control unit, which determines whether the security code having the EBG pattern is recognized using the phase difference data. In an alternate embodiment, the voltage control oscillator is controlled to sequentially generate signals using power difference data.

    摘要翻译: 在用于识别具有使用EBG图案的反射和传输特性的电磁带隙(EBG)模式的安全码的装置中,压控振荡器产生信号到功率分配器,功率分配器将信号的功率分成两半, 并且通过波导输出要入射到EBG图案上的第一信号。 波导接收从EBG图案反射的信号,并将反射信号输出到相位检测器。 循环器将第二信号输出到检测反射信号和第二信号之间的相位差的相位检测器,并将相位差数据输出到数据控制单元,数据控制单元确定是否使用EBG图案识别具有EBG图案的安全码 相位差数据。 在替代实施例中,控制电压控制振荡器以使用功率差数据顺序产生信号。

    Method of fabricating a photomask using self assembly molecule
    6.
    发明授权
    Method of fabricating a photomask using self assembly molecule 失效
    使用自组装分子制造光掩模的方法

    公开(公告)号:US07901848B2

    公开(公告)日:2011-03-08

    申请号:US12345101

    申请日:2008-12-29

    申请人: Jin Ho Ryu

    发明人: Jin Ho Ryu

    IPC分类号: G03F1/00 G03F7/20

    CPC分类号: G03F1/68

    摘要: A method of fabricating a photomask includes includes forming a light blocking layer over a transparent substrate, and forming a hard mask pattern over the light blocking layer. The hard mask pattern exposes a portion of the light blocking layer. The method also includes depositing a self assembly molecule (SAM) layer over the hard mask pattern. The SAM layer covers the hard mask pattern and a portion of the exposed light blocking layer. The method also includes forming a resist layer pattern over an exposed portion of the light blocking layer that is not covered by the deposited SAM layer. The method further includes removing the SAM layer to expose the hard mask pattern and the light blocking layer, and etching the light blocking layer with the hard mask pattern and the resist layer pattern to form the photomask. Still further, the method includes removing the hard mask pattern and the resist layer pattern. The disclosed method permits one to manufacture fine patterns in semiconductor devices utilizing conventional apparatus and materials.

    摘要翻译: 制造光掩模的方法包括在透明基板上形成遮光层,并在遮光层上形成硬掩模图案。 硬掩模图案曝光遮光层的一部分。 该方法还包括在硬掩模图案上沉积自组装分子(SAM)层。 SAM层覆盖硬掩模图案和暴露的遮光层的一部分。 该方法还包括在未被沉积的SAM层覆盖的遮光层的暴露部分上形成抗蚀剂层图案。 该方法还包括去除SAM层以暴露硬掩模图案和遮光层,并用硬掩模图案和抗蚀剂层图案蚀刻遮光层以形成光掩模。 此外,该方法包括去除硬掩模图案和抗蚀剂层图案。 所公开的方法允许使用常规设备和材料在半导体器件中制造精细图案。

    Method of Fabricating a Photomask Using Self Assembly Molecule
    7.
    发明申请
    Method of Fabricating a Photomask Using Self Assembly Molecule 失效
    使用自组装分子制造光掩模的方法

    公开(公告)号:US20090258303A1

    公开(公告)日:2009-10-15

    申请号:US12345101

    申请日:2008-12-29

    申请人: Jin Ho Ryu

    发明人: Jin Ho Ryu

    IPC分类号: G03F1/00

    CPC分类号: G03F1/68

    摘要: A method of fabricating a photomask includes includes forming a light blocking layer over a transparent substrate, and forming a hard mask pattern over the light blocking layer. The hard mask pattern exposes a portion of the light blocking layer. The method also includes depositing a self assembly molecule (SAM) layer over the hard mask pattern. The SAM layer covers the hard mask pattern and a portion of the exposed light blocking layer. The method also includes forming a resist layer pattern over an exposed portion of the light blocking layer that is not covered by the deposited SAM layer. The method further includes removing the SAM layer to expose the hard mask pattern and the light blocking layer, and etching the light blocking layer with the hard mask pattern and the resist layer pattern to form the photomask. Still further, the method includes removing the hard mask pattern and the resist layer pattern. The disclosed method permits one to manufacture fine patterns in semiconductor devices utilizing conventional apparatus and materials.

    摘要翻译: 制造光掩模的方法包括在透明基板上形成遮光层,并在遮光层上形成硬掩模图案。 硬掩模图案曝光遮光层的一部分。 该方法还包括在硬掩模图案上沉积自组装分子(SAM)层。 SAM层覆盖硬掩模图案和暴露的遮光层的一部分。 该方法还包括在未被沉积的SAM层覆盖的遮光层的暴露部分上形成抗蚀剂层图案。 该方法还包括去除SAM层以暴露硬掩模图案和遮光层,并用硬掩模图案和抗蚀剂层图案蚀刻遮光层以形成光掩模。 此外,该方法包括去除硬掩模图案和抗蚀剂层图案。 所公开的方法允许使用常规设备和材料在半导体器件中制造精细图案。

    Method for fabricating photomask
    8.
    发明授权
    Method for fabricating photomask 失效
    光掩模的制造方法

    公开(公告)号:US08053148B2

    公开(公告)日:2011-11-08

    申请号:US12346517

    申请日:2008-12-30

    申请人: Jin Ho Ryu

    发明人: Jin Ho Ryu

    IPC分类号: G03F1/00

    CPC分类号: G03F1/68 G03F1/80

    摘要: Provided is a method for fabricating a photomask. A light blocking layer is formed on a transparent substrate having a first region and a second region. A hard mask layer is formed on the light blocking layer. A first polymer film is formed on the hard mask layer. Here, the first polymer film is formed of single strand polymers that can form a complementary binding. A portion of the first polymer film corresponding to the first region is changed to comprise polymers having partial complementary binding. A hard mask pattern for exposing a portion of the light blocking layer under the first polymer film is formed by performing an etching process using the changed portion as an etch stop. A light blocking pattern is formed by removing an exposed portion of the light blocking layer by performing an etching process using the hard mask pattern as an etch mask, and then removing the hard mask pattern.

    摘要翻译: 提供一种制造光掩模的方法。 在具有第一区域和第二区域的透明基板上形成遮光层。 在遮光层上形成硬掩模层。 在硬掩模层上形成第一聚合物膜。 这里,第一聚合物膜由可形成互补结合的单链聚合物形成。 对应于第一区域的第一聚合物膜的一部分改变为包含具有部分互补结合的聚合物。 通过使用改变部分作为蚀刻停止层进行蚀刻处理,形成用于暴露第一聚合物膜下面的遮光层的一部分的硬掩模图案。 通过使用硬掩模图案作为蚀刻掩模进行蚀刻处理,然后去除硬掩模图案,通过去除遮光层的暴露部分来形成遮光图案。

    Method for fabricating photo mask
    9.
    发明授权
    Method for fabricating photo mask 失效
    光掩模制作方法

    公开(公告)号:US07838179B2

    公开(公告)日:2010-11-23

    申请号:US11950567

    申请日:2007-12-05

    申请人: Jin Ho Ryu

    发明人: Jin Ho Ryu

    IPC分类号: G03F1/00

    CPC分类号: G03F1/72 G03F1/80

    摘要: In a method for fabricating a photo mask, first resist patterns are formed on a transparent substrate where a light blocking layer and a phase shift layer are formed. Line widths of the first resist patterns are measured to define a region requiring a line width correction. Second resist patterns exposing the defined region are formed on the first resist patterns. The line width of the light blocking layer is corrected by over-etching the exposed light blocking layer to a predetermined thickness. The second resist patterns are removed. Phase shift patterns and light blocking patterns are formed using the first resist patterns as an etch mask. Then, the first resist patterns are removed.

    摘要翻译: 在制造光掩模的方法中,在形成有阻光层和相移层的透明基板上形成第一抗蚀剂图案。 测量第一抗蚀剂图案的线宽度以限定需要线宽校正的区域。 在第一抗蚀剂图案上形成暴露限定区域的第二抗蚀剂图案。 通过将暴露的遮光层过蚀刻到预定厚度来校正遮光层的线宽。 去除第二抗蚀剂图案。 使用第一抗蚀剂图案作为蚀刻掩模形成相移图案和遮光图案。 然后,去除第一抗蚀剂图案。

    Method for Fabricating Photo Mask
    10.
    发明申请
    Method for Fabricating Photo Mask 失效
    制作照片面具的方法

    公开(公告)号:US20080280214A1

    公开(公告)日:2008-11-13

    申请号:US11950567

    申请日:2007-12-05

    申请人: Jin Ho Ryu

    发明人: Jin Ho Ryu

    IPC分类号: G03F1/00

    CPC分类号: G03F1/72 G03F1/80

    摘要: In a method for fabricating a photo mask, first resist patterns are formed on a transparent substrate where a light blocking layer and a phase shift layer are formed. Line widths of the first resist patterns are measured to define a region requiring a line width correction. Second resist patterns exposing the defined region are formed on the first resist patterns. The line width of the light blocking layer is corrected by over-etching the exposed light blocking layer to a predetermined thickness. The second resist patterns are removed. Phase shift patterns and light blocking patterns are formed using the first resist patterns as an etch mask. Then, the first resist patterns are removed.

    摘要翻译: 在制造光掩模的方法中,在形成有阻光层和相移层的透明基板上形成第一抗蚀剂图案。 测量第一抗蚀剂图案的线宽度以限定需要线宽校正的区域。 在第一抗蚀剂图案上形成暴露限定区域的第二抗蚀剂图案。 通过将暴露的遮光层过蚀刻到预定厚度来校正遮光层的线宽。 去除第二抗蚀剂图案。 使用第一抗蚀剂图案作为蚀刻掩模形成相移图案和遮光图案。 然后,去除第一抗蚀剂图案。