Invention Grant
- Patent Title: Connector assembly having a floating mating array
- Patent Title (中): 具有浮动配合阵列的连接器组件
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Application No.: US12757835Application Date: 2010-04-09
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Publication No.: US08292644B2Publication Date: 2012-10-23
- Inventor: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger , Attalee Snarr Taylor
- Applicant: Richard Elof Hamner , Robert Neil Mulfinger , Jason M'Cheyne Reisinger , Attalee Snarr Taylor
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R13/64
- IPC: H01R13/64

Abstract:
A connector assembly includes a housing, a mating array, and a self-alignment subassembly. The housing is joined to a first circuit board and includes a header portion that moves in a mating direction toward a second circuit board. The mating array is joined to the header portion and includes a terminal. The mating array is moveable in the mating direction to couple the terminal with a mating terminal of the second circuit board. The self-alignment subassembly is disposed between the header portion and the mating array. The self-alignment subassembly applies a floating force on the mating array that permits alignment of the terminal of the mating array with the mating terminal while the mating array is moved in directions oriented approximately perpendicular to the mating direction. The self-alignment subassembly also applies a loading force on the mating array in the mating direction that couples the terminal of the mating array with the mating terminal.
Public/Granted literature
- US20110250773A1 CONNECTOR ASSEMBLY HAVING A FLOATING MATING ARRAY Public/Granted day:2011-10-13
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