Invention Grant
US08293609B2 Method of manufacturing a transistor device having asymmetric embedded strain elements
有权
制造具有非对称嵌入式应变元件的晶体管器件的方法
- Patent Title: Method of manufacturing a transistor device having asymmetric embedded strain elements
- Patent Title (中): 制造具有非对称嵌入式应变元件的晶体管器件的方法
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Application No.: US13355221Application Date: 2012-01-20
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Publication No.: US08293609B2Publication Date: 2012-10-23
- Inventor: Rohit Pal , Frank Bin Yang , Michael J. Hargrove
- Applicant: Rohit Pal , Frank Bin Yang , Michael J. Hargrove
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee: GLOBALFOUNDRIES, Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
Semiconductor transistor devices and related fabrication methods are provided. An exemplary transistor device includes a layer of semiconductor material having a channel region defined therein and a gate structure overlying the channel region. Recesses are formed in the layer of semiconductor material adjacent to the channel region, such that the recesses extend asymmetrically toward the channel region. The transistor device also includes stress-inducing semiconductor material formed in the recesses. The asymmetric profile of the stress-inducing semiconductor material enhances carrier mobility in a manner that does not exacerbate the short channel effect.
Public/Granted literature
- US20120129311A1 METHOD OF MANUFACTURING A TRANSISTOR DEVICE HAVING ASYMMETRIC EMBEDDED STRAIN ELEMENTS Public/Granted day:2012-05-24
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