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US08293609B2 Method of manufacturing a transistor device having asymmetric embedded strain elements 有权
制造具有非对称嵌入式应变元件的晶体管器件的方法

Method of manufacturing a transistor device having asymmetric embedded strain elements
Abstract:
Semiconductor transistor devices and related fabrication methods are provided. An exemplary transistor device includes a layer of semiconductor material having a channel region defined therein and a gate structure overlying the channel region. Recesses are formed in the layer of semiconductor material adjacent to the channel region, such that the recesses extend asymmetrically toward the channel region. The transistor device also includes stress-inducing semiconductor material formed in the recesses. The asymmetric profile of the stress-inducing semiconductor material enhances carrier mobility in a manner that does not exacerbate the short channel effect.
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