Invention Grant
- Patent Title: Electronic device case and method for manufacturing the same
- Patent Title (中): 电子设备案例及其制造方法
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Application No.: US12585727Application Date: 2009-09-23
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Publication No.: US08294055B2Publication Date: 2012-10-23
- Inventor: Cheul Gon Kim , Jun Gyu Song , Kyoung Min Lee , Jun Ho Park , Jin Ho Jung
- Applicant: Cheul Gon Kim , Jun Gyu Song , Kyoung Min Lee , Jun Ho Park , Jin Ho Jung
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2008-0097018 20081002
- Main IPC: H01H9/00
- IPC: H01H9/00
Abstract:
Disclosed are an electronic device case provided with a touch sensor unit having an improved adherence structure and a method for manufacturing the same. The electronic device case includes a cover, and a touch sensor unit arranged on a front surface of the cover.
Public/Granted literature
- US20100085692A1 Electronic device case and method for manufacturing the same Public/Granted day:2010-04-08
Information query
