发明授权
- 专利标题: Semiconductor integrated circuit device and method of fabricating the same
- 专利标题(中): 半导体集成电路器件及其制造方法
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申请号: US12704312申请日: 2010-02-11
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公开(公告)号: US08294198B2公开(公告)日: 2012-10-23
- 发明人: Dong-Chul Yoo , Eun-Ha Lee , Byong-Ju Kim , Hyung-Ik Lee , Sung Heo , Han-Mei Choi , Chan-Hee Park , Ki-Hyun Hwang
- 申请人: Dong-Chul Yoo , Eun-Ha Lee , Byong-Ju Kim , Hyung-Ik Lee , Sung Heo , Han-Mei Choi , Chan-Hee Park , Ki-Hyun Hwang
- 申请人地址: KR Suwon-Si, Gyeonggi-Do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si, Gyeonggi-Do
- 代理机构: F. Chau & Associates, LLC
- 优先权: KR10-2009-0011078 20090211
- 主分类号: H01L29/72
- IPC分类号: H01L29/72
摘要:
A semiconductor integrated circuit device is provided. The semiconductor integrated circuit device includes a plurality of isolation regions which are formed within a semiconductor substrate and define active regions. A tunnel layer and a trap seed layer are formed in each of the active regions and are sequentially stacked between the isolation regions. A trap layer is formed on the trap seed layer and protrudes further than a top surface of each of the isolation regions. A blocking layer is formed on the trap layer. A gate electrode is formed on the blocking layer.
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