Invention Grant
US08295013B1 Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features
有权
具有具有传热限制特征的柔性印刷电路的磁盘驱动器磁头组件组件
- Patent Title: Disk drive head stack assembly having a flexible printed circuit with heat transfer limiting features
- Patent Title (中): 具有具有传热限制特征的柔性印刷电路的磁盘驱动器磁头组件组件
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Application No.: US13398578Application Date: 2012-02-16
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Publication No.: US08295013B1Publication Date: 2012-10-23
- Inventor: Tzong-Shii Pan , Daniel Nguyen , Shujun Tang
- Applicant: Tzong-Shii Pan , Daniel Nguyen , Shujun Tang
- Applicant Address: US CA Irvine
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: G11B5/127
- IPC: G11B5/127
Abstract:
A head stack assembly (HSA) for a disk drive includes an actuator body, at least one actuator arm extending from the actuator body, and a flexible printed circuit (FPC). The FPC includes first and second pluralities of electrically conductive FPC traces, each having a distal portion that terminates at a respective one of a plurality of FPC bond pads. The HSA also includes a head gimbal assembly (HGA) having a laminate flexure with a plurality of electrically conductive flexure bond pads that are bonded to the plurality of FPC bond pads. A width of at least one of the first plurality of FPC traces is greater than a width of at least one of the second plurality of FPC traces. The distal portion of at least one of the first plurality FPC traces includes a first opening therethrough, for example less than 1 mm from its corresponding FPC bond pad.
Information query
IPC分类:
