Invention Grant
US08296687B2 System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
失效
使用第一原理模拟来分析由半导体处理工具执行的处理的系统和方法
- Patent Title: System and method for using first-principles simulation to analyze a process performed by a semiconductor processing tool
- Patent Title (中): 使用第一原理模拟来分析由半导体处理工具执行的处理的系统和方法
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Application No.: US10673506Application Date: 2003-09-30
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Publication No.: US08296687B2Publication Date: 2012-10-23
- Inventor: Eric J. Strang , Andrej Mitrovic
- Applicant: Eric J. Strang , Andrej Mitrovic
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A method, system and computer readable medium for analyzing a process performed by a semiconductor processing tool. The method includes inputting data relating to a process performed by the semiconductor processing tool, and inputting a first principles physical model relating to the semiconductor processing tool. First principles simulation is performed using the input data and the physical model to provide a first principles simulation result; and the first principles simulation result is used to determine a fault in the process performed by the semiconductor processing tool.
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