发明授权
US08297488B2 Bump forming method using self-assembling resin and a wall surface
有权
使用自组装树脂和壁面的凸起成形方法
- 专利标题： Bump forming method using self-assembling resin and a wall surface
- 专利标题（中）： 使用自组装树脂和壁面的凸起成形方法
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申请号： US12282774申请日： 2007-02-22
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公开(公告)号： US08297488B2公开(公告)日： 2012-10-30
- 发明人: Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
- 申请人： Seiji Karashima , Yasushi Taniguchi , Seiichi Nakatani , Kenichi Hotehama , Takashi Kitae , Susumu Sawada
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2006-087032 20060328
- 国际申请： PCT/JP2007/053863 WO 20070222
- 国际公布： WO2007/122868 WO 20071101
- 主分类号： B23K31/00
- IPC分类号： B23K31/00 ; B23K31/02
摘要：
A method for forming bumps 19 on electrodes 32 of a wiring board 31 includes the steps of: (a) supplying a fluid 14 containing conductive particles 16 and a gas bubble generating agent onto a first region 17 including the electrodes 32 on the wiring board 31; (b) disposing a substrate 40 having a wall surface 45 formed near the electrodes 32 for forming a meniscus 55 of the fluid 14, so that the substrate 40 faces the wiring board 31; and (c) heating the fluid 14 to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.
公开/授权文献
- US20090078746A1 BUMP FORMING METHOD AND BUMP FORMING APPARATUS 公开/授权日：2009-03-26
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