发明授权
- 专利标题： Patterning a thick film paste in surface features
- 专利标题（中）： 在表面特征中形成厚膜糊
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申请号： US12809687申请日： 2008-12-19
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公开(公告)号： US08298034B2公开(公告)日： 2012-10-30
- 发明人: Lap-Tak Andrew Cheng
- 申请人： Lap-Tak Andrew Cheng
- 申请人地址： US DE Wilmington
- 专利权人： E I du Pont de Nemours and Company
- 当前专利权人： E I du Pont de Nemours and Company
- 当前专利权人地址： US DE Wilmington
- 国际申请： PCT/US2008/087673 WO 20081219
- 国际公布： WO2009/086100 WO 20090709
- 主分类号： H01J9/12
- IPC分类号： H01J9/12
摘要：
This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.
公开/授权文献
- US20100314989A1 PATTERNING A THICK FILM PASTE IN SURFACE FEATURES 公开/授权日：2010-12-16
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