Invention Grant
- Patent Title: Patterning a thick film paste in surface features
- Patent Title (中): 在表面特征中形成厚膜糊
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Application No.: US12809687Application Date: 2008-12-19
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Publication No.: US08298034B2Publication Date: 2012-10-30
- Inventor: Lap-Tak Andrew Cheng
- Applicant: Lap-Tak Andrew Cheng
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- International Application: PCT/US2008/087673 WO 20081219
- International Announcement: WO2009/086100 WO 20090709
- Main IPC: H01J9/12
- IPC: H01J9/12
Abstract:
This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.
Public/Granted literature
- US20100314989A1 PATTERNING A THICK FILM PASTE IN SURFACE FEATURES Public/Granted day:2010-12-16
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