发明授权
- 专利标题： Conductive paste, printed circuit board, and manufacturing method thereof
- 专利标题（中）： 导电浆料，印刷电路板及其制造方法
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申请号： US12076117申请日： 2008-03-13
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公开(公告)号： US08298447B2公开(公告)日： 2012-10-30
- 发明人: Ki-Hwan Kim , Jee-Soo Mok , Myung-Sam Kang
- 申请人： Ki-Hwan Kim , Jee-Soo Mok , Myung-Sam Kang
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-0061835 20070622
- 主分类号： H01B1/02
- IPC分类号： H01B1/02 ; H01B1/22 ; B32B37/00 ; B29C44/34 ; C08J9/22
摘要：
A conductive paste, a printed circuit board using the conductive paste, and a method of manufacturing the printed circuit board are disclosed. A conductive paste that includes conductive particles, a polymer, and a polymer foam, can reduce the number of printing repetitions, to simplify the manufacturing process, decrease process times, and improve reliability.
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