Printed circuit board having fine pattern and manufacturing method thereof
    5.
    发明申请
    Printed circuit board having fine pattern and manufacturing method thereof 审中-公开
    具有精细图案的印刷电路板及其制造方法

    公开(公告)号:US20070059917A1

    公开(公告)日:2007-03-15

    申请号:US11520729

    申请日:2006-09-14

    IPC分类号: H01L21/44 H01L21/4763

    摘要: A manufacturing method for a printed circuit board having a fine pattern is disclosed, comprising: providing a carrier plate; coating the carrier plate with a photosensitive material; forming a first circuit pattern on the photosensitive material; forming a first circuit layer by drying a conductive paste printed into a space between the photosensitive materials where the first circuit pattern is formed; depositing an insulation layer on the first circuit layer; processing via holes penetrating the insulation layer; coating the insulation layer with the photosensitive material and then forming a second circuit pattern in the photosensitive material; forming a second circuit layer and filling the via holes by drying the conductive paste printed into a space between the photosensitive materials, where the second circuit pattern is formed, and the via holes; and removing the carrier plate.

    摘要翻译: 公开了一种具有精细图案的印刷电路板的制造方法,包括:提供载板; 用感光材料涂覆载体板; 在感光材料上形成第一电路图案; 通过干燥印刷在形成有第一电路图案的感光材料之间的空间中的导电浆料形成第一电路层; 在第一电路层上沉积绝缘层; 通过贯穿绝缘层的孔加工; 用感光材料涂覆绝缘层,然后在感光材料中形成第二电路图案; 形成第二电路层,并通过干燥印刷在其中形成第二电路图案的感光材料之间的空间中的导电浆料和通孔来填充通孔; 并移除载体板。

    Printed circuit board and manufacturing method thereof
    6.
    发明授权
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号:US08058558B2

    公开(公告)日:2011-11-15

    申请号:US11984115

    申请日:2007-11-13

    IPC分类号: H05K1/00 H05K7/06

    摘要: A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

    摘要翻译: 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法,其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体,使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体,所述焊盘的区域可以被减小以制造印刷电路板 高密度,并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性,以提高高密度印刷电路板的性能。

    Printed circuit board and manufacturing method thereof
    7.
    发明申请
    Printed circuit board and manufacturing method thereof 有权
    印刷电路板及其制造方法

    公开(公告)号:US20080115961A1

    公开(公告)日:2008-05-22

    申请号:US11984115

    申请日:2007-11-13

    IPC分类号: H05K1/00 H05K3/10 H05K7/06

    摘要: A printed circuit board and a manufacturing method thereof are disclosed. Using a method of manufacturing a printed circuit board which includes forming a circuit pattern, which includes lands, on a first board; forming a paste bump on the land of the first board; and stacking an insulation on a surface of the first board such that the paste bump penetrates the insulation, where the paste bump is formed to cover the land of the first board, the areas of the lands can be reduced to manufacture a printed circuit board of high density, and the contact reliability can be increased due to the increase in contact area between the lands and paste bumps to improve the performance of the high-density printed circuit-board.

    摘要翻译: 公开了印刷电路板及其制造方法。 使用制造印刷电路板的方法,其包括在第一板上形成包括焊盘的电路图案; 在第一板的焊盘上形成焊膏; 并且在所述第一板的表面上堆叠绝缘体,使得所述焊膏凸块穿过形成所述焊膏以覆盖所述第一板的焊盘的所述绝缘体,所述焊盘的区域可以被减小以制造印刷电路板 高密度,并且由于焊盘和焊膏之间的接触面积的增加可以提高接触可靠性,以提高高密度印刷电路板的性能。

    Printed circuit board using bump and method for manufacturing thereof
    8.
    发明申请
    Printed circuit board using bump and method for manufacturing thereof 失效
    使用凸块的印刷电路板及其制造方法

    公开(公告)号:US20070235220A1

    公开(公告)日:2007-10-11

    申请号:US11727838

    申请日:2007-03-28

    IPC分类号: H05K1/11 H01R12/04

    摘要: The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

    摘要翻译: 本发明提供一种制造印刷电路板的方法和由此制造的印刷电路板,其中通过反向脉冲电镀填充芯板的通孔,从而允许制造具有大于100μm的 在现有技术难以达到现有技术的加工限制以及在厚绝缘层上形成凸块的厚度,由于芯板的强度提高,堆叠时产生的焊膏凸起的压力抵抗力提高, 层之间的连接,散热效果优异,并且集体堆叠芯板,这对于常规方法是不可能的。

    Printed circuit board using bump and method for manufacturing thereof
    9.
    发明授权
    Printed circuit board using bump and method for manufacturing thereof 失效
    使用凸块的印刷电路板及其制造方法

    公开(公告)号:US08549744B2

    公开(公告)日:2013-10-08

    申请号:US11727838

    申请日:2007-03-28

    IPC分类号: H01K3/10

    摘要: The present invention provides a method for manufacturing a printed circuit board and a print circuit board manufactured thereby, in which through holes of a core board are filled by reverse pulse plating so that it allows to manufacture a core board having greater than 100 μm of a thickness which has been a processing limitation with conventional technologies and form bumps on a thick insulation layer, which has been difficult till now, and thus providing resistance against pressure of paste bumps produced during stacking due to the increased strength of a core board, convenience to join between layers, excellent heat-releasing effect, and collectively stacking of core boards, which was not possible with conventional methods.

    摘要翻译: 本发明提供一种制造印刷电路板的方法和由此制造的印刷电路板,其中通过反向脉冲电镀填充芯板的通孔,从而允许制造具有大于100μm的 在现有技术难以达到现有技术的加工限制以及在厚绝缘层上形成凸块的厚度,由于芯板的强度提高,堆叠时产生的焊膏凸起的压力抵抗力提高, 层之间的连接,散热效果优异,并且集体堆叠芯板,这对于常规方法是不可能的。